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Industry Solution Overview

The semiconductor packaging industry faces challenges with limited factory space and complex equipment operation processes. Additionally, the high complexity of product combinations has contributed to a shortage of skilled talent, We provide a one-stop service solutions to assist our customers in achieving full automation of their production lines. This solution not only helps client achieve full automation of their production lines but also increases production capacity by at least 10%.

Industry Analysis

Limited space in the field area

The Wire Bonding equipment is densely arranged.

High man-machine ratio

Due to the complexity of equipment operation processes, a significant number of personnel are required for configuration, resulting in a man-machine ratio of approximately 1:30.

High complexity of product combinations

The complex nature of product combinations leads to increased time and cost associated with account verification and inspection.

Solution

iAMHS (Intelligent Automated Material Handling System)

Intelligent Scheduled Material Management Optimized Delivery Routes Multi-Size Magazine Solution Standard System Communication Interface

RGV AMR
  • Various Magazine Support
  • Enhancing Material Handling Efficiency
  • Increased machine utilization

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